2023 Notre Dame Student Peace Conference

(part of a series)

Location: Hesburgh Center for International Studies (View on map )

Student Peace Con

Sponsored by the Kroc Institute for International Peace Studies

The Notre Dame Student Peace Conference is an annual conference organized by undergraduate peace studies students at the University of Notre Dame. The conference provides a space for undergraduate and graduate students to dialogue about peacebuilding, social justice, and conflict transformation, and fosters a learning environment in which students can present their ideas, research, and experiences within a network of peers who share their personal and academic interest in building a more just and peaceful world.

Conference Theme: Voices: Naming War, Speaking Peace

Over the past year, we have witnessed a resurgence of old tensions alongside new conflicts. Injustice, violence, and inequality affect individuals differently but have profound impacts in any society. As current and future peacebuilders, we are tasked with understanding how belief systems, cultural histories, and collective values shape opportunities for peace and justice in contexts of both direct and structural violence.

Whether these narratives are present in newspaper headlines, personal experiences, or academic scholarship, they amplify the voices of those who endure violence and struggle for peace. Inspired by this year's Forum topic, conference planners chose this theme to help advance thinking beyond the traditional dichotomy of war and peace and toward an illumination of how violence, conflict, and injustice affect our everyday lives no matter where we live. 

Call for Proposals

The conference committee invites undergraduate and graduate students from all different fields of study to submit interdisciplinary proposals that address these questions or that demonstrate how their own work, practice, or scholarship advances the field of peace studies and its understanding of justice.

The submission deadline is Friday, January 27, 2023. 

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